激光切割是利用高功率密度激光束照射被切割材料，使材料很快被加热至汽化温度，蒸发形成孔洞，随着光束对材料的移动，孔洞连续形成宽度很窄的（如0．1mm左右）切缝，完成对材料的切割。

激光切割可分为以下四类

1.激光汽化切割

2.激光熔化切割

3.激光氧气切割

4.激光划片控制断裂

Laser cutting uses high-power density laser beams to irradiate the cut material, so that the material is quickly heated to vaporization temperature and evaporates to form holes. As the beam moves toward the material, the holes continuously form a narrow width(eg, about 0.1 mm).) Cutting seams, Complete the cutting of the material.
Laser cutting can be divided into the following four categories
1. Laser vaporization cutting
2. Laser melting and cutting
3. Laser oxygen cutting
4. Laser splicing control fracture